Memory suppliers are finally acknowledging our HBM de-spec call.
AISK Hynix publicly said 16-hi is difficult, and the market is now prioritizing bandwidth over capacity. Hybrid bonding’s case in HBM was always stack height, and at 4-hi and 8-hi there is no height problem to solve. D2W hybrid bonding for HBM has gone from a question of when to a question of if. (1/3)🧵